Open-Cavity Plastic Packages: A Practical Approach to IC Prototyping
Developing a new IC involves more than designing and fabricating the die. At some point, the device needs to be assembled into a package so engineers can begin electrical testing, characterization,...
View ArticleBeyond the Grating: Rethinking High-Power Semiconductor Laser Reliability for...
Who Is This For This article is for photonics and semiconductor engineers, optical-module designers, reliability teams, datacenter-network architects, and technical leaders who are evaluating laser...
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Heraeus Electronics Webinar: What materials perform when failure is not an...
Link to Register As automotive, aerospace and defense, industrial, and advanced electronics continue to advance, the demands placed on applications are becoming more stringent. Across these markets,...
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Why Optical High-Volume Test is 10x More Challenging than Electrical...
Unlike electrical testing for semiconductors, automating optical test is extremely difficult because of the general finickiness of photonic designs, fragmentation of electronic – photonic design...
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Can Embedded Passives Fix AI’s Power Delivery Problem?
What you’ll learn: Where are the real power “bottlenecks” in AI data centers? How in-package passive components could change the situation. What engineers need to know when evaluating package-level...
View ArticleRapidus Unveils “Rapidus CORE”, New Global Ecosystem Framework Supporting the...
As part of its first phase, Rapidus is announcing the formation of Design Solution Associates to help customers support early-stage design for Rapidus’ advanced 2nm semiconductor foundry UPDATE:...
View ArticleApplied Materials and KIOXIA Partner at the EPIC Center to Advance...
Companies will collaborate to develop advanced memory structures, chip stacking technologies and materials engineering innovations to increase AI memory performance KIOXIA joins Applied Materials’...
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Overcoming Cleaning and Plating Challenges in Panel-Level Packaging and...
Advances in automotive, high-performance computing (HPC), artificial intelligence (AI) and medical technology are heightening demand for heterogeneous integration. As a result, the semiconductor...
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Toray Develops Industry-First Technology to Recover PPS from Waste Materials
Toray Industries, Inc., announced today that it has developed what it believes is, as of the publication of this release, the industry’s first solvent-based recycling technology to recover...
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Halftone Photomasks for Next-Generation Displays
Modern flat-panel displays depend on highly complex multilayer structures fabricated on enormous glass substrates. As display generations continue to grow, lithography must combine large-area...
View ArticleIndium Corporation Experts to Present Advanced Packaging, AI, and...
As a leading provider of high-reliability, AI-enabling soldering materials, three Indium Corporation experts will share new research and insights on addressing advanced packaging and high-power...
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Brewer Science to Present High-Temperature-Stable Laser-Release Material and...
Brewer Science, a global leader in advanced materials for the semiconductor and microelectronics industries, will take part in two sessions at the 59th International Symposium on Microelectronics...
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Siemens and TSMC advance AI-powered Semiconductor Design Automation
Siemens’ EDA portfolio supports TSMC advanced process technologies, TSMC 3DFabric® technologies and silicon photonics design enablement Joint innovations help mutual customers accelerate productivity,...
View ArticleStratEdge to Showcase Versatile Molded Ceramic Packages for MIL-STD...
StratEdge Corporation, a leader in the design and production of high-frequency, high-power, and high-reliability packages, will feature its molded ceramic packages at their upcoming exhibition in...
View ArticlePrecision at Speed: Silver Sintering for Next-Gen Power Module
Smaller chips, tighter tolerances, faster production:In modern power modules, there is very little room for error in the die-attach process. How can throughput be increased without compromising...
View ArticleAccelerating the Transition to Intel 18A for Secure National Security...
As federal agencies and defense organizations race to modernize the technologies that underpin national security, the semiconductor industry has entered a new era. Artificial intelligence at the edge,...
View ArticleAdhesives for Cryogenic Applications
Read the Full Paper Learn how specialty adhesives withstand the severe conditions found in cryogenic environments while allowing mechanical assemblies to maintain their integrity and reliability. Find...
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See What the IMAPS 59th Symposium on Microelectronics Exhibit Hall Has in Store!
Thank you to our valued IMAPS exhibitors for your continued support and partnership. Your participation helps make our events successful, fosters industry connections, and showcases the latest...
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IMAPS 59th International Symposium on Microelectronics: Technical Program and...
The International Microelectronics Assembly and Packaging Society (IMAPS) will host the 59th International Symposium on Microelectronics (IMAPS Symposium 2026) from September 28 to October 1, 2026, at...
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Kurtz Ersa to Spotlight Its Comprehensive Semiconductor Solutions at IMAPS...
Kurtz Ersa Inc. will exhibit for the first time at the IMAPS Symposium 2026, held Sept. 29-Oct. 1 at Encore Boston Harbor – 1 Broadway, Everett, MA 02149. The company will host a tabletop display at...
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